Job Description

Job Description An Insight Global client in Tucson, AZ is seeking a packaging engineer who comes from a process engineering background to join their team. This person will be responsible for process improvements to the company's wire/die bonding, oven vacuum and pick and place machine manufacturing process. The team currently has the front end of the process automated, but the backend is not currently automated - therefore a background and experience in setting up automated systems is critical as the team explores further automation. This person must have strong experience in Lean Six Sigma principles, root cause analysis, continuous improvement and process SPC. This role does require the employee to be in-person in Tucson, AZ, but there is some day-to-day schedule flexibility as long as the job is getting completed. This role can pay between $90k and $100k and relocation assistance can be offered on a case-by-case basis. Exact compensation may vary based on education and experience. We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: Skills and Requirements - Bachelor's or Master's Degree in Mechanical Engineering or related  - At least 3 years of experience with process engineering in the semiconductor industry assembling and improving laser equipment - specifically die bonding, wire bonding, and vacuum ovens.  - Strong SPC capabilities and analysis skills to excel in continuous improvement.  - Experience with process engineering around pick and place machines.  - Knowledge of Lean Six Sigma principles. Experience with CAD software - Draftsight preferred

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